AMD V3000 COM Express Type 7 - IC Power Dissipation Heatmap

Interactive per-IC power dissipation heatmap for the SolidRun AMD Ryzen Embedded V3000 COM Express Type 7 module. Select the CPU (V3C18I or V3C48), the BIOS CPU Power Limit and the number of SODIMM mo

Per-IC power dissipation of the AMD V3000 COM Express Type 7 module, colored by power density (log scale).

Use the CPU, CPU Power Limit and SODIMM modules selectors; the map, the totals and the heat-sensitive parts table follow the selection. Board 95 × 125 mm · 28 dissipating parts top / 3 bottom · total estimated dissipation ≈ 74.2 W at the V3C48 54 W limit with two SODIMM modules

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NOTE:

• The CPU Power Limit selector covers V3C18I 8 - 15 W and V3C48 8 - 54 W, in 1 W steps. The APU dissipation is modelled as equal to the selected limit.
• SODIMM modules are assumed at 5 W each. Their heat is carried by the module and is drawn over the on-board part of the socket. With one module fitted, socket 1 (DIMM1, top side) is assumed.
• Parts below 0.05 W at every power limit (most passives, connectors) are shown as faint outlines and excluded from the analysis. Hover a part to see its dissipation and the basis of the estimate.
• The BOTTOM side is an X-ray view from above and is not mirrored: it has the same orientation as the TOP side.
• The heat spread view is relative (1 = maximum of the selected view) and is not a temperature. By default it excludes the APU and the SODIMM modules, which have their own heat paths (heatsink, module).

Estimate, not a thermal measurement. Dissipation values are estimated from datasheet data and engineering assumptions at the selected power limit, on the real placement and board stackup. No heatsink, airflow, enclosure or ambient temperature is modelled. Use this page for design guidance only, and validate thermal performance in the target system. For cooling of the module, see Heatsink and Cooling in the AMD V3000 Based COM Type 7 Hardware User Manual.