AMD R8000 Based COM Type 6 Hardware User Manual
Revisions and Notes
Date
Owner
Revision
Notes
January 07, 2026
Firas Abd El Gani
WIP
Introduction
This document is intended for hardware engineers that are willing to integrate the SolidRun AMD R8000 FP7r2 based COM express Type 6 module.
The document provides details with regards module rev 1.0
Specifications
Form Factor
COM Express type 6
Processor Core
Hawk Point 8840U - 8 Cores Strix Point HX370 - 12 Cores
Processor speed
Memory
Dual SO-DIMM DDR5 4800 MT\s up to 96GByte combined
ECC
Optional
SPI for BIOS
32MB
SATA
2 x SATA (Gen III)
Security
fTPM with optional discrete TPM (not soldered by default)
Supported OS
Linux, Yocto, FreeBSD etc…
PCIe Gen 4.0
USB 3.2
4
I2C
UART
SPI bus
Power
12V (9V-24V)
Environment
Commercial: 0°C to 70°C Industrial: -40°C to 85°C Humidity (non-condensing): 10% – 90%
Dimensions
125mm X 95mm
Overview
SolidRun’s AMD based R8000 COM Type 6 is a highly integrated COM modules where special care was taken care for the module’s height to accomodate thin and low profile designs.
The module integrates the following features –
AMD R8000 FP7r2 series. Other FP7r2 processors can be assembled. Please refer to SolidRun’s sales about more details.
Two SO-DIMM DDR5 connected to quad independent DDR5 contorllers. Each SO-DIMM supports up to 48GByte SO-DIMM DDR4 4800Mtps memory with and without ECC; total up to 96GByte system memory.
Single 12v DC-input is required. 5V Standby not required and not supported.
Since this module is based on SolidRun’s Bedrock product line, it shares lots of the design and features such as memory modules that were tested -
Description
Block Diagram
The following figure describes the AMD R8000 COM express type 6 Blocks Diagram.
Simplified Schematics
Following is a link to that simplified schematics (currently only COM headers) of the board :
The AMD R8000 COM Express Type 6 simplified schematics is intended for the following audience –
Software and Firmware engineers that enables them to understand the IO and signal connectivity of the COM express design.
Hardware engineers that are willing to use the COM express and build their own solution. This document completes the reference manual from description of signal and implementation wise.
Heatsink and Cooling
A heatsink for this COM module was developed to accomodate multiple scenarios. Please look below for rendering without a fan -
This heatsink can be used as in the following -
With 40mm or 60mm fan - please refer to the M2.5 screws on the top of the heatsink. Take into account that the max thread inside the heatsink is 6mm.
In a 1U chassis where an air flow goes through the fins of the heatsink.
Standalone - The customer is required to assemble the heatsink the fan and measure max load can be used in his specific application and specific air movement and ambient temperatures
The fan part number is HS00030 and is offered with the module when bought as samples.
Refer to the documentation section withregards 3D model of HS00030.
Module Power Consumption Measurements
The following power consumption measurements were conducted on the following setup –
HoneyComb AMD R8000 mini-ITX motherboard with pico-psu ATX power source
AMD Strix Point HX370 processor (12 cores) or Hawk Point 8840U (8 cores) on COM express Type 6 module connected.
Two SO-DIMM DDR5 at 4800Mtps (total 2x48GB = 96GByte system memory).
During the tests a 1.3 Watt fan was mounted on the processor. The idle, memtester and first cpu-burn power measurements below include those 1.3 Watt, the measurements with die temperature of 65c and above has the fan disconnected.
Temperature measurement was done using Linux ‘sensors’ commands, that reads both the PCB (print side of the board away from the center) and the processor die temperature.
Software running is standard Linux Ubuntu distribution software release.
A 12v PSU is connected to a pico-psu (12v to ATX); and power is measured by multiplying the current and the voltage on the 12v input rail.
Since the measurement are done on the input of the pico-psu; the SoC consumption all together with the DDR and all the DC-DC losses are measured too.
Test
Power (Watt)
PCB Temperature (Celsius)
Die Temperature (Celsius)
Linux idle
TBD
TBD
TBD
16x memtester 100M (*)
TBD
TBD
TBD
2x cpuburn-krait (**)
TBD
TBD
TBD
Please note (*) – The Linux command is ‘memtester 100M > /dev/null &’ ran 16x times where 16 is the thread count (**) – The Linux command ‘cpuburn’ is ran two times in background. The reason cpuburn was chosen since it can generate most heat out of the cores (the core pipeline most utilized). (***) – This measurement was taken when the fan is disconnected and the power was measured when the die reached 105c. Notice that keeping the fan disconnected will make the processor reach temperatures that are out of spec.
Maximum Current Consumption
TBD
PCIe Lane Numbers and Bucket Grouping
TBD
SERDES configuration
TBD
AB Header
Schematics Signal Name (COM6)
Driving IC
Schematics Pin Name (COM6 Header Symbol)
Pin Number
Pin Number
Schematics Pin Name (COM6 Header Symbol)
Driving IC
Notes
1
GND (FIXED)
A1
B1
GND (FIXED)
2
Intel i.226
GBE0_MDI3-
A2
B2
GBE0_ACT#
Intel i.226
3
Intel i.226
GBE0_MDI3+
A3
B3
ESPI_CS0#
1.8v with 3.3v protection
4
PHY1_LED_SPEED_1000#
Intel i.226
GBE0_LINK_MID#
A4
B4
ESPI_IO_0
1.8v with 3.3v protection
5
PHY1_LED_SPEED_2500#
Intel i.226
GBE0_LINK_MAX#
A5
B5
ESPI_IO_1
1.8v with 3.3v protection
6
Intel i.226
GBE0_MDI2-
A6
B6
ESPI_IO_2
1.8v with 3.3v protection
7
Intel i.226
GBE0_MDI2+
A7
B7
ESPI_IO_3
1.8v with 3.3v protection
8
In case the customer carrier doesn’t support SPEED_1000#, or SPEED_2500#.
Shorted to pin A5 (PHY1_LED_SPEED_2500#)
GBE0_LINK#
A8
B8
ESPI_ALERT0#
1.8v with 3.3v protection
9
Intel i.226
GBE0_MDI1-
A9
B9
ESPI_ALERT1#
10
Intel i.226
GBE0_MDI1+
A10
B10
ESPI_CK
1.8v with 3.3v protection
11
GND (FIXED)
A11
B11
GND (FIXED)
12
Intel i.226
GBE0_MDI0-
A12
B12
PWRBTN#
AMD Power button
OD 3.3v level shifted
13
Intel i.226
GBE0_MDI0+
A13
B13
SMB_CK
APU_SCLK1
3.3v 2.2k pulled-up OD. 2Kb EEPROM at address 0x50 on COM
14
Not used
GBE0_CTREF
A14
B14
SMB_DAT
APU_SCLK1
15
3.3v AMD SLP_S3# via series 1K Ohm resistor. Do not load. If used buffer it.
AMD
SUS_S3#
A15
B15
SMB_ALERT#
16
Serial 10nF
AMD GPP TX11 (PCIe-to-SATA3 bridge)
SATA0_TX+
A16
B16
SATA1_TX+
AMD GPP TX10
Serial 10nF
17
SATA0_TX
A17
B17
SATA1_TX-
18
Not used
SUS_S4#
A18
B18
ESPI_RESET
AMD ESPI Reset
1.8v with 3.3v protection
19
Serial 10nF
AMD GPP TX11 (PCIe-to-SATA3 bridge)
SATA0_RX+
A19
B19
SATA1_RX+
AMD GPP RX10
Serial 10nF
20
SATA0_RX
A20
B20
SATA1_RX-
21
GND (FIXED)
A21
B21
GND (FIXED)
22
Not used
SATA2_TX+
A22
B22
SATA3_TX+
23
Not used
SATA2_TX-
A23
B23
SATA3_TX-
24
3.3v AMD SLP_S5# via series 1K Ohm resistor. Do not load. If used buffer it.
AMD
SUS_S5#
A24
B24
PWR_OK
Power management IC
Refer to power-up sequence
25
Not used
SATA2_RX+
A25
B25
SATA3_RX+
not used
26
Not used
SATA2_RX-
A26
B26
SATA3_RX-
not used
27
Not used
BATLOW#
A27
B27
WDT
28
Signal Name: M2_SSD0_LED# 3.3v output from COM6 M.2 NVME Module.
M.2 NVME Module
SATA_ACT#
A28
B28
HDA_SDIN2/SNDW0_CLK
AZ_SDIN0/SW0_MDATA3_HDR New added in COM spec rev 3.1
29
AMD Signal: AZ_SYNC/SW1_MDATA0/TDM0_FRM_HDR
AMD (through 1.8V to 3.3V level shifter)
HDA_SYNC
A29
B29
HDA_SDIN1/SNDW0_DAT
AMD GPP CLK 1
AZ_SDIN1/SW0_MCLK_TDM1_BCLK_HDR AZ_SDIN2/SW0_MDATA0/TDM1_OUT_HDR New added in COM spec rev 3.1
30
AMD Signal: AZ_RST#/SW0_MDATA1/TDM0_DIN_HDR
AMD (through 1.8V to 3.3V level shifter)
HDA_RST#
A30
B30
HDA_SDIN0
31
GND (FIXED)
A31
B31
GND (FIXED)
32
AMD Signal: AZ_BITLK/SW1_MCLK/TDM0_BCLK_HDR
HDA_BITCLK
A32
B32
SPKR
33
AMD Signal: AZ_SDOUT/SW0_MDATA2/TDM0_DOUT_HDR
HDA_SDOUT
A33
B33
I2C_CK
AMD APU I2C0
3.3v 2.2k pulled-up OD
34
Not used
BIOS_DIS0#
A34
B34
I2C_DAT
35
Not used
THRMTRIP#
A35
B35
THRM#
36
AMD Signal: USBN2
USB6-
A36
B36
USB7-
USBN3
37
AMD Signal: USBNP
USB6+
A37
B37
USB7+
USBNP
38
AMD Signal: USB_OC0_L/AGPIO16
USB_6_7_OC#
A38
B38
USB_4_5_OC#
3.3v 2.2k pulled-up OD. Shorted to COM B44, A38, A44.
39
AMD Signal: USBC0_DN
USB4-
A39
B39
USB5-
USBC1_DN
40
AMD Signal: USBC0_DP
USB4+
A40
B40
USB5+
USBC1_DP
41
GND (FIXED)
A41
B41
GND (FIXED)
42
AMD Signal: USB_HOSTDS2_DN
AMD → USB HUB
USB2-
A42
B42
USB3-
AMD → USB HUB
USB_HOSTDS3_DN
43
AMD Signal: USB_HOSTDS2_DP
USB2+
A43
B43
USB3+
USB_HOSTDS3_DP
44
3.3v 2.2k pulled-up OD. Shorted to COM B44, A38, B38.
AMD
USB_2_3_OC#
A44
B44
USB_0_1_OC#
AMD
3.3v 2.2k pulled-up OD. Shorted to COM A38, B38, A44.
45
USBC4_DN
AMD
USB0-
A45
B45
USB1-
AMD → USB HUB
USB_HOSTDS1_DN
46
USBC4_DP
USB0+
A46
B46
USB1+
USB_HOSTDS1_DP
47
Connected to BAT54C Oring Diode
AMD
VCC_RTC
A47
B47
ESPI_EN
48
RSMRST# via R9524 zero ohm resistor
AMD
RSMRST_OUT#
A48
B48
USB0_HOST_PRSNT
49
Pulled down with 100k ohm to GND
Intel i.226 pin 15 (PHY1_SDP)
GBE0_SDP
A49
B49
SYS_RESET#
AMD
3.3v, 2.2k pull-up, sys reset input
50
Not used
LPC_SERIRQ
A50
B50
CB_RESET#
AMD PCIe Reset
3.3v with series 22ohm resistor and 220pF to GND (snubber)
51
GND (FIXED)
A51
B51
GND (FIXED)
52
Serial 220nF
AMD GPP TX13
PCIE_TX5+
A52
B52
PCIE_RX5+
AMD GPP RX13
53
PCIE_TX5-
A53
B53
PCIE_RX5-
54
AGPIO7
micro SD D0
GPI0
A54
B54
GPO1
AMD
AGPIO38
55
Serial 220nF
AMD GPP TX12
PCIE_TX4+
A55
B55
PCIE_RX4+
AMD GPP RX12
56
PCIE_TX4-
A56
B56
PCIE_RX4-
57
GND
A57
B57
GPO2
AMD
AGPIO39
58
Serial 220nF
AMD GPP TX19
PCIE_TX3+
A58
B58
PCIE_RX3+
AMD GPP RX19
59
PCIE_TX3-
A59
B59
PCIE_RX3-
60
GND (FIXED)
A60
B60
GND (FIXED)
61
Serial 220nF
AMD GPP TX18
PCIE_TX2+
A61
B61
PCIE_RX2+
AMD GPP RX18
62
PCIE_TX2-
A62
B62
PCIE_RX2-
63
AGPIO8
micro SD D1
GPI1
A63
B63
GPO3/SD_CD
AMD
AGPIO6
64
Serial 220nF
AMD GPP TX17
PCIE_TX1+
A64
B64
PCIE_RX1+
AMD GPP RX17
65
PCIE_TX1-
A65
B65
PCIE_RX1-
66
GND
A66
B66
WAKE0#
AMD
3.3v OD PCIe Wake
67
AGPIO27
micro SD D2
GPI2
A67
B67
WAKE1#
68
Serial 220nF
AMD GPP TX16
PCIE_TX0+
A68
B68
PCIE_RX0+
AMD GPP RX16
69
PCIE_TX0-
A69
B69
PCIE_RX0-
70
GND (FIXED)
A70
B70
GND (FIXED)
71
DP0_TX2P (two options LVDS or eDP - 0R Resistors)
LVDS_A0+
A71
B71
LVDS_B0+
72
DP0_TX2N (two options LVDS or eDP - 0R Resistors)
LVDS_A0-
A72
B72
LVDS_B0-
73
DP0_TX1P (two options LVDS or eDP - 0R Resistors)
LVDS_A1+
A73
B73
LVDS_B1+
74
DP0_TX1N (two options LVDS or eDP - 0R Resistors)
LVDS_A1-
A74
B74
LVDS_B1-
75
DP0_TX0P (two options LVDS or eDP - 0R Resistors)
LVDS_A2+
A75
B75
LVDS_B2+
76
DP0_TX0N (two options LVDS or eDP - 0R Resistors)
LVDS_A2-
A76
B76
LVDS_B2-
77
DP0_DIGON
LVDS_VDD_EN
A77
B77
LVDS_B3+
78
LVDS
LVDS_A3+
A78
B78
LVDS_B3-
79
LVDS
LVDS_A3-
A79
B79
LVDS_BKLT_EN